PI directory

21 principal investigators, auto-profiled from public data.

Filtering by topic 3D IC and TSV technologies — clear

Engineering · Purdue University West Lafayette · active through 2026

Advanced Sensor and Energy Harvesting MaterialsConducting polymers and applicationsOrganic Electronics and PhotovoltaicsVery activeEstablished

Carol A. Handwerker

Engineering · Purdue University West Lafayette · active through 2026

Electronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure Properties3D IC and TSV technologiesActiveEstablished

Cheng‐Kok Koh

Engineering · Purdue University West Lafayette · active through 2026

VLSI and FPGA Design TechniquesLow-power high-performance VLSI designVLSI and Analog Circuit TestingActiveEstablished

Gerald Beyer

Engineering · The Ohio State University · active through 2026

3D IC and TSV technologiesCopper Interconnects and ReliabilitySemiconductor materials and devicesVery activeEstablished

Ganesh Subbarayan

Engineering · Purdue University West Lafayette · active through 2026

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesNumerical methods in engineeringVery activeEstablished

Tiwei Wei

Engineering · Purdue University West Lafayette · active through 2026

Heat Transfer and OptimizationHeat Transfer Mechanisms3D IC and TSV technologiesVery activeMid career

Byung-Hyun Lee

Engineering · Purdue University West Lafayette · active through 2026

Semiconductor materials and devicesAdvancements in Semiconductor Devices and Circuit DesignNanowire Synthesis and ApplicationsActiveEstablished

Shubhra Bansal

Engineering · Purdue University West Lafayette · active through 2026

Perovskite Materials and ApplicationsQuantum Dots Synthesis And PropertiesChalcogenide Semiconductor Thin FilmsVery activeEstablished

Prabudhya Roy Chowdhury

Materials Science · Purdue University West Lafayette · active through 2026

Thermal properties of materialsAdvanced Thermoelectric Materials and Devices3D IC and TSV technologiesActiveMid career

Arvind Sundaram

Engineering · Purdue University West Lafayette · active through 2026

3D IC and TSV technologiesSmart Grid Security and ResilienceAdversarial Robustness in Machine LearningVery activeEstablished

Shuwei He

Engineering · The Ohio State University · active through 2026

3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesMicrowave Engineering and WaveguidesActiveMid career

Shuhang Lyu

Engineering · Purdue University West Lafayette · active through 2026

3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityActiveEarly career

Pei-En Chou

Medicine · Purdue University West Lafayette · active through 2026

Cardiomyopathy and Myosin StudiesCellular Mechanics and InteractionsElectronic Packaging and Soldering TechnologiesActiveMid career

Zhengwei Chen

Engineering · Purdue University West Lafayette · active through 2026

Electronic Packaging and Soldering TechnologiesMicrofluidic and Bio-sensing Technologies3D IC and TSV technologiesSelective outputEarly career

Fei Qin

Engineering · Purdue University West Lafayette · active through 2025

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Memory and Neural ComputingVery activeEstablished

John A. Wu

Engineering · Purdue University West Lafayette · active through 2025

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and ReliabilitySelective outputEarly career

Xinkang Chen

Physics and Astronomy · Purdue University West Lafayette · active through 2025

Semiconductor Quantum Structures and DevicesSemiconductor materials and devicesCopper Interconnects and ReliabilityActiveEstablished

Michael J. Smith

Engineering · Purdue University West Lafayette · active through 2025

VLSI and FPGA Design TechniquesAdvancements in Photolithography TechniquesAdvanced Thermodynamics and Statistical MechanicsSelective outputEstablished

Hyungyung Jo

Materials Science · Purdue University West Lafayette · active through 2024

Nanoporous metals and alloysLow-power high-performance VLSI designVLSI and FPGA Design TechniquesSelective outputMid career

Glenn Blackwell

Engineering · Purdue University West Lafayette · active through 2024

Electronic Packaging and Soldering TechnologiesExperimental Learning in Engineering3D IC and TSV technologiesSelective outputEstablished

Chetan Jois

Engineering · Purdue University West Lafayette · active through 2024

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloy Microstructure PropertiesSelective outputEarly career