LabCompass

Chetan Jois

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Early career · publishing since 2019
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAluminum Alloy Microstructure PropertiesManufacturing Process and OptimizationAdvanced Numerical Analysis Techniques

Publications

11

Citations

22

Est. group size

~3

Recurring co-author estimate

Active years

6

Publishing since 2019

Research summary
AI-generated

Chetan Jois's research focuses on the reliability and manufacturing of microelectronic packaging, particularly how tiny solder joints and metal interconnects degrade over time when exposed to heat. This work involves both computational modeling (simulating void formation and material growth at microscopic scales) and experimental testing methods to understand failure mechanisms in advanced chip packaging technologies like 3D integrated circuits and copper hybrid bonding.

Microelectronic packaging reliabilitySolder joint degradation and void formationComputational modeling of materials (phase field, reaction-diffusion)3D chip integration and hybrid bondingComputer-aided engineering and simulation methods

Publication activity has been modest and uneven over the past decade, with no output in several years followed by a notable increase in 2022 and 2024.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 1.8/year recently
17182019: 1 publication192020: 1 publication20212022: 4 publications4222023: 1 publication232024: 4 publications4242526
Recent publications
Publishes in
  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)×3
  • IEEE Transactions on Components Packaging and Manufacturing Technology×1
  • Computer-Aided Design and Applications×1
  • Journal of Electronic Materials×1
  • ECS Meeting Abstracts×1
Similar researchers
By research-topic overlap

This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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