LabCompass

John A. Wu

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Early career · publishing since 2018
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and ReliabilityMicrostructure and mechanical propertiesMetal and Thin Film Mechanics

Publications

11

Citations

128

Est. group size

~2

Recurring co-author estimate

Active years

8

Publishing since 2018

Research summary
AI-generated

John A. Wu studies the microstructure and reliability of metal films and solder joints used in electronic packaging, focusing on how the orientation and growth of metal grains (such as copper, gold, and tin) affects the performance and durability of microelectronic connections. His work involves fabricating specially structured thin films, including 'nanotwinned' metal films, for applications like direct metal-to-metal bonding used in advanced 3D chip packaging.

Electronic packaging and interconnectsMetal thin-film microstructureNanotwinned copper and gold filmsSolder joint reliabilityDirect metal bonding for 3D chip integration

Publication output has been low and irregular over the past decade, with occasional years of activity (2018-2020, 2022) interspersed with years of no recorded output.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 1.0/year recently
172018: 1 publication182019: 2 publications192020: 3 publications320212022: 2 publications22232024: 1 publication242025: 2 publications2526
Recent publications
Publishes in
  • Materials×3
  • Crystal Growth & Design×2
  • Journal of Electronic Materials×2
  • Advanced Engineering Materials×2
  • Scientific Reports×1
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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