Pavan Kumar Vaitheeswaran
Engineering · Purdue University West Lafayette
Publications
12
Citations
67
Est. group size
~1
Recurring co-author estimate
Active years
9
Publishing since 2017
This researcher works on the reliability and mechanics of electronic packaging materials, particularly how metal interconnects and thin films degrade under electrical current and temperature stress (electromigration). A second strand of work involves computational geometry methods, such as algebraic surface modeling and boundary analysis, used in engineering design and simulation tools. The work bridges materials reliability engineering and computational/numerical methods for geometric modeling.
Publication output has been low and irregular over the last decade, with small yearly counts, a peak of 4 in 2020, and gaps in 2022 and 2024, averaging under one paper per year over the last five years.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures
IEEE Transactions on Components Packaging and Manufacturing Technology · 2025
- The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature
IEEE Transactions on Components Packaging and Manufacturing Technology · 2023
- Improved Dixon Resultant for Generating Signed Algebraic Level Sets and Algebraic Boolean Operations on Closed Parametric Surfaces
Computer-Aided Design · 2021
- A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy
Computational Mechanics · 2020
- Algebraic Point Projection for Immersed Boundary Analysis on Low Degree NURBS Curves and Surfaces
Algorithms · 2020
- Topological Modifications through Boolean Compositions on Algerbraic Level Sets Constructed from B-rep Models
Computer-Aided Design and Applications · 2020
- Topological Modifications through Boolean Compositions on Algebraic Level Sets Constructed from B-rep Models
2019
- Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress
Continuum Mechanics and Thermodynamics · 2019
- Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
Journal of Electronic Packaging · 2018
- Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials (TIMs) by a Random Network Model
2017
- IEEE Transactions on Components Packaging and Manufacturing Technology×2
- Computational Mechanics×1
- Journal of Electronic Packaging×1
- Continuum Mechanics and Thermodynamics×1
- Computer-Aided Design×1
- Pylin Sarobol
Engineering · Purdue University West Lafayette
- John A. Wu
Engineering · Purdue University West Lafayette
- Carol A. Handwerker
Engineering · Purdue University West Lafayette
- Chetan Jois
Engineering · Purdue University West Lafayette
- Ganesh Subbarayan
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile