LabCompass

Ganesh Subbarayan

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Established · publishing since 1988
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesNumerical methods in engineeringThermal properties of materialsAdvanced Numerical Analysis Techniques

Publications

254

Citations

2,247

Est. group size

~19

Recurring co-author estimate

Active years

39

Publishing since 1988

Research summary
AI-generated

Ganesh Subbarayan's research focuses on the mechanical and thermal reliability of electronic packaging, the technology used to house and interconnect computer chips. His work combines computational modeling (finite element methods, multiscale simulation) with materials science to study how solder joints, packaging materials, and heterogeneously integrated chip assemblies deform, crack, and age under thermal and mechanical stress. This work supports the design of more durable and efficient electronic devices as chip packaging becomes more complex.

Electronic packaging reliabilitySolder joint mechanics and agingComputational/finite element modelingHeterogeneous chip integrationFracture mechanics

Publication output has grown from a handful of papers per year in 2017-2018 to a sustained higher rate of roughly 8-12 papers annually from 2022 onward, indicating steady to growing research activity over the past decade.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 9.4/year recently
2017: 3 publications172018: 4 publications182019: 8 publications192020: 10 publications202021: 4 publications212022: 11 publications222023: 12 publications12232024: 9 publications242025: 7 publications252026: 8 publications26
Recent publications
Publishes in
  • IEEE Transactions on Components Packaging and Manufacturing Technology×8
  • Journal of Electronic Materials×5
  • 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)×5
  • Journal of Electronic Packaging×3
  • Computer-Aided Design×2
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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