LabCompass

Fei Qin

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Established · publishing since 1993Rising activity
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Memory and Neural ComputingAluminum Alloys Composites PropertiesAdvanced MIMO Systems Optimization

Publications

85

Citations

742

Est. group size

~2

Recurring co-author estimate

Active years

33

Publishing since 1993

Research summary
AI-generated

Fei Qin's work centers on the mechanics and reliability of electronic packaging, including thermal, structural, and fatigue analysis of chip and wafer-level interconnect structures using numerical methods like finite element and boundary element modeling. The publication record also includes a mix of unrelated topics (e.g., biomedical and agricultural studies), suggesting the name may be associated with multiple distinct researchers or collaborations across fields. Prospective students should note this apparent topic diversity when trying to understand the scope of this research group.

Electronic packaging reliability and thermomechanical analysisNumerical/computational methods (finite element, boundary element, virtual element)Semiconductor and wafer-level structures (through-silicon vias, RDL, interposers)Heat transfer and thermal management in packaging processesMiscellaneous unrelated topics (biomedical, agricultural, immunology)

Publication output was low and variable in the mid-2010s to early 2020s but has grown substantially since 2022, with the last few years (2023-2025) showing the highest activity.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 7.6/year recently
2017: 10 publications172018: 3 publications182019: 3 publications192020: 1 publication202021: 3 publications212022: 6 publications222023: 12 publications12232024: 11 publications242025: 9 publications2526
Recent publications
Publishes in
  • Springer briefs in electrical and computer engineering×6
  • ECS Meeting Abstracts×3
  • Materials Advances×2
  • IEEE Transactions on Applied Superconductivity×2
  • Ironmaking & Steelmaking Processes Products and Applications×2
Similar researchers
By research-topic overlap

This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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