LabCompass

Pylin Sarobol

Engineering · Purdue University West Lafayette

OpenAlex
Mid career · publishing since 2010
Electronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityHigh-Temperature Coating BehaviorsAdvanced ceramic materials synthesisAluminum Alloy Microstructure Properties

Publications

43

Citations

329

Est. group size

—

Recurring co-author estimate

Active years

17

Publishing since 2010

Research summary
AI-generated

Pylin Sarobol's research focuses on materials processing techniques for electronics and coatings, including thermal spray and cold spray coatings, aerosol deposition of ceramic and metallic thin films, and additive manufacturing of hybrid electronic circuits. Work also examines microstructure and reliability of soldered and wire-bonded electronic components, such as diffusion behavior in copper wire bonds and whisker growth in tin films used in electronic packaging.

Thermal and cold spray coatingsAerosol deposition of thin filmsAdditive manufacturing of electronicsElectronic packaging reliability (solder, wire bonds)Microstructure of metals and ceramics

Publication output was concentrated between 2016 and 2020, with no recorded outputs from 2021 to 2025 and a single item appearing in 2026, suggesting a slowing or paused publication record in recent years.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 0.2/year recently
2017: 2 publications172018: 1 publication182019: 1 publication192020: 3 publications32021222324252026: 1 publication26
Recent publications
  • Crystallographic Texture and Whisker Growth in Electroplated Sn and Sn-Alloy Films

    IMAPSource Proceedings · 2026

  • Microstructure and Properties of Cold-Sprayed Iron Coatings.

    2020

  • Leveraging Thermal Spray Coating Technology in Additive Manufacturing.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2020

  • ACCELERATED AGING AND TESTING OF THIN FILM TEST VEHICLES WITH Ag AND Au TKN PASTE.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2019

  • Microstructure and Properties of Room Temp Deposited Thick BaTiO3 Dielectric Films.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2018

  • Fundamental Mechanisms Behind Room Temperature Aerosol Deposition for Fabrication of Meso-Scale Metallic & Ceramic Films.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2017

  • Understanding Cu-Al Limited-Volume Diffusion Towards Lifetime Prediction for Cu Wire Bonds.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2017

  • Additive Manufacturing of Hybrid Circuits

    Annual Review of Materials Research · 2016

  • Aerosol Method for Room Temperature Thick-Film Deposition

    AM&P Technical Articles · 2016

  • Aerosol Deposition: Room Temperature Solid-State Deposition of Ceramics

    2016

  • Deposition Behavior in Cold Sprayed Copper-Tungsten Metal Matrix Composites.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2016

  • Experimental validation of microparticle physics models.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2016

  • Integration of Multi-materials in Additive Manufacturing.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2016

  • Deformation Behaviors of Sub-micron and Micron Sized Alumina Particles in Compression.

    OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) · 2016

Publishes in
  • OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)×9
  • Annual Review of Materials Research×1
  • Scripta Materialia×1
  • JOM×1
  • AM&P Technical Articles×1
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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