Chun Yu
Engineering · Purdue University West Lafayette
Publications
107
Citations
1,759
Est. group size
—
Recurring co-author estimate
Active years
20
Publishing since 2006
This researcher works on advanced metal joining and manufacturing, focusing on high-entropy alloys, welding, and additive manufacturing processes like laser deposition and cladding. Much of the work examines how microstructure and interface characteristics affect the strength, wear resistance, and corrosion resistance of engineered metal joints and coatings. Some recent publications also branch into materials science topics like semiconductor heterostructures, sensors, and surface chemistry, suggesting collaborative or interdisciplinary projects.
Publication output fluctuated over the past decade, dipping around 2021-2022 before rising again to a peak in 2024, with a slight decrease in 2025 (based on partial-year data).
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- A dual-function flexible pressure/humidity sensitive sensor based on a polyaniline-coated melamine sponge
New Journal of Chemistry · 2025
- Substitutional doping-induced tunable van der Waals heterostructures of X-WSe2/Ti2CO2 in optoelectronic properties: A first-principles study
Vacuum · 2025
- Differences in interfacial bonding capacity of CoCrFeMnNi high-entropy alloy joints with diverse initial microstructures produced by vacuum hot-compression bonding
Journal of Alloys and Compounds · 2025
- Substitutional Doping-Induced Tunable Van Der Waals Heterostructures of X-Wse2/Ti2co2 in Optoelectronic Properties: A First-Principles Study
SSRN Electronic Journal · 2025
- Helium bubbles evolution mechanism of SA508-3/52 joint and its effect on nanoindentation hardness and swelling
Heat Treatment and Surface Engineering · 2025
- Enhanced photoelectrocatalytic performance of N-acetylaminobenzoic acid-doped PDMS composite photoelectrodes for oxygen evolution reaction in water splitting
Journal of Electroanalytical Chemistry · 2025
- Effect of initial grain size on the interfacial bonding behavior of CoCrFeMnNi high-entropy alloy joints produced by vacuum hot-compression bonding
SSRN Electronic Journal · 2025
- Multivariate Diffusion Transformer with Decoupled Attention for High-Fidelity Mask-Text Collaborative Facial Generation
arXiv (Cornell University) · 2025
- Crack inhibition of non-weldable Inconel 738 alloy in ultrasound-assisted laser directed energy deposition
Materials Science and Engineering A · 2024
- Revealing multiphysics effects on microstructure characteristics in powder-fed laser cladding based on a comprehensive model
Journal of Materials Research and Technology · 2024
- Enhanced carrier mobility and interface charge transfer in Bi–MoS2 heterojunctions induced by point defects
Vacuum · 2024
- Enhancement in interfacial bonding quality of CoCrFeMnNi high-entropy alloy vacuum hot-compression bonding via surface shot peening
Materials Characterization · 2024
- Enhancing hot corrosion resistance of N-doping NiCoCr-based superalloy coatings fabricated by directed energy deposition in mixed molten salts
Surface and Coatings Technology · 2024
- A novel strategy to enhance the interfacial bonding quality of CoCrFeMnNi high-entropy alloy joints produced by vacuum hot-compression bonding
Materials Science and Engineering A · 2024
- In-situ N-doping to improve wear and corrosion resistance of a complex-concentrated alloy manufactured by directed energy deposition
Tribology International · 2024
- Materials Science and Engineering A×8
- SSRN Electronic Journal×6
- Journal of Materials Processing Technology×5
- Materials Characterization×5
- Transactions on intelligent welding manufacturing×4
- Pylin Sarobol
Engineering · Purdue University West Lafayette
- David Adams
Engineering · Indiana University
- Carol A. Handwerker
Engineering · Purdue University West Lafayette
- Chetan Jois
Engineering · Purdue University West Lafayette
- Fei Qin
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile