David Adams
Engineering · Indiana University
Electronic Packaging and Soldering TechnologiesMetallurgical and Alloy ProcessesParticle physics theoretical and experimental studiesAortic aneurysm repair treatmentsParticle Detector Development and Performance
Publications
30
Citations
569
Est. group size
—
Recurring co-author estimate
Active years
50
Publishing since 1976
Publication cadence
Publications per year over the last 10 years — averaging 0.2/year recently
Recent publications
- Integrating Prehabilitation into Surgical Pathways: Current Modalities, Outcomes, and Research Gaps
medRxiv · 2025
- Deep Underground Neutrino Experiment (DUNE), Far Detector Technical Design Report, Volume II: DUNE Physics
arXiv (Cornell University) · 2020
- Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys
Journal of Electronic Materials · 2019
- Effect of Thermal Treatment on the Microstructure, Properties, and Reliability of Lead-Free Bismuth Containing Solder Alloys
Journal of Surface Mount Technology · 2019
- Restoration of Microstructure and Mechanical Properties of Lead-Free Bismuth Containing Solder Joints after Accelerated Reliability Testing Using a Thermal Treatment
SMTA International · 2018
- Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys
Journal of Surface Mount Technology · 2018
- Accelerated Life Testing Solder Reliability in Combined Environments: Isothermal Conditions with Harmonic Vibration
Journal of Surface Mount Technology · 2018
- Screening in the community to reduce fractures in older women (SCOOP): a randomised controlled trial
The Lancet · 2017
- Thermal Preconditioning, Microstructure Restoration and Property Improvement in Bi-Containing Solder Alloys
Soldering and Reliability Conferences · 2017
- Accelerated Life Testing Solder Reliability in Combined Environments: ISO Temperatures with Harmonic Vibration
Soldering and Reliability Conferences · 2017
- Protocol Development for Testing Solder Reliability in Combined Environments
Soldering and Reliability Conferences · 2016
Publishes in
- Journal of Surface Mount Technology×3
- Soldering and Reliability Conferences×3
- The Lancet×1
- Journal of Electronic Materials×1
- arXiv (Cornell University)×1
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 9, 2026.
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