Arvind Sundaram
Engineering · Purdue University West Lafayette
Publications
49
Citations
573
Est. group size
~1
Recurring co-author estimate
Active years
34
Publishing since 1993
This researcher works on advanced semiconductor manufacturing, focusing on techniques for building 3D and 2.5D integrated circuits, including through-silicon vias (TSVs), wafer-to-wafer hybrid bonding, and silicon carbide (SiC) power device fabrication. The work is largely process-engineering oriented, addressing challenges like fine-pitch interconnections, high-aspect-ratio etching, and photolithography alignment for chip packaging and photonic devices. A few unrelated publications on medical case reports and AI-based surveillance also appear in the record, suggesting either interdisciplinary side projects or possible name overlap in the data.
Publication output has grown over the last decade, rising from about 1 paper per year in 2017-2020 to a steady 5-10 papers per year since 2021.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- 200-mm SiC Power Device Technology Platform enabled by Process and Integration Innovations
2026
- Ambulatory Electrocardiogram-Detected ST-Segment Elevation and Ventricular Tachycardia in Coronary Vasospasm
HeartRhythm Case Reports · 2026
- Scalability and Process Optimization in Hybrid Bonding with Fine-Pitch Interconnections
2025
- Patterning of Sub 1 μM CD TSV and Bond Pad for Fine-Pitch 2.5D/3D Hybrid Bonding Applications
2025
- Addressing Key Process Challenges in Developing High Aspect Ratio TSVs up to 15 with 1 μm Critical Dimension
2025
- Study of SiC Trench Etching Characteristics for Different Crystal Planes
Materials science forum · 2025
- Low-Power Thermo-Optic Switching Enabled by Spiral Waveguides and Glass–Silicon Hybrid Bonding
IEEE Access · 2025
- High-Aspect-Ratio TSiCV Etch Development in 4H-SiC for RF Interposer Applications
2025
- Cu/Dielectric hybrid bonding among Glass and Si
2024
- Sub-0.5 μm Pitch Scaling of W2W Cu/Dielectric Hybrid Bonding
2024
- Fabrication of c-Si Pillars on Glass Substrates for Terahertz Dielectric Metasurfaces Using Glass-Silicon Direct Bonding
2024
- Patterning of 1µm Through Silicon via Critical Dimension Using Positive Tone Resist Mask with a Photolithography Stepper
2024
- A Precise Wafer Thinning Integration Process for nano-TSV Formation
2023
- Model-based optical proximity correction for immersion lithography-based flat optics platform
2023
- Laser integration on a photonic integrated circuit with high alignment accuracy for data transmission
2023
- Nuclear Science and Engineering×5
- Transactions of the American Nuclear Society×4
- Nuclear Technology×3
- Progress in Nuclear Energy×2
- Frontiers in Nuclear Engineering×2
- Shuwei He
Engineering · The Ohio State University
- Shuhang Lyu
Engineering · Purdue University West Lafayette
- Gerald Beyer
Engineering · The Ohio State University
- Fei Qin
Engineering · Purdue University West Lafayette
- Ganesh Subbarayan
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile