LabCompass

Arvind Sundaram

Engineering · Purdue University West Lafayette

Established · publishing since 1993Rising activity

Publications

49

Citations

573

Est. group size

~1

Recurring co-author estimate

Active years

34

Publishing since 1993

Research summary
AI-generated

This researcher works on advanced semiconductor manufacturing, focusing on techniques for building 3D and 2.5D integrated circuits, including through-silicon vias (TSVs), wafer-to-wafer hybrid bonding, and silicon carbide (SiC) power device fabrication. The work is largely process-engineering oriented, addressing challenges like fine-pitch interconnections, high-aspect-ratio etching, and photolithography alignment for chip packaging and photonic devices. A few unrelated publications on medical case reports and AI-based surveillance also appear in the record, suggesting either interdisciplinary side projects or possible name overlap in the data.

3D chip integration and TSV fabricationWafer-to-wafer hybrid bondingSilicon carbide (SiC) power device processingPhotolithography and patterning techniquesPhotonic and optical device integration

Publication output has grown over the last decade, rising from about 1 paper per year in 2017-2020 to a steady 5-10 papers per year since 2021.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 7.0/year recently
2017: 1 publication172018: 2 publications182019: 1 publication192020: 1 publication202021: 5 publications212022: 9 publications222023: 10 publications10232024: 5 publications242025: 8 publications252026: 3 publications26
Publishes in
  • Nuclear Science and Engineering×5
  • Transactions of the American Nuclear Society×4
  • Nuclear Technology×3
  • Progress in Nuclear Energy×2
  • Frontiers in Nuclear Engineering×2
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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