LabCompass

Shuhang Lyu

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Early career · publishing since 2021Rising activity
3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilitySemiconductor materials and devicesHeat Transfer Mechanisms

Publications

21

Citations

85

Est. group size

~2

Recurring co-author estimate

Active years

6

Publishing since 2021

Research summary
AI-generated

Shuhang Lyu's work focuses on advanced semiconductor packaging, particularly the design, fabrication, and reliability of tiny vertical electrical connections (through-silicon vias and through-glass vias) used to stack computer chips into compact 3D structures. The research also covers related thermal management challenges, such as cooling densely packed chips and predicting mechanical stress in these microscopic structures using experimental characterization and machine learning. This work is relevant to students interested in the physical engineering behind next-generation, high-density computer chip packaging.

3D chip stacking and through-silicon vias (TSVs)Semiconductor packaging reliabilityThermomechanical stress analysis in microelectronicsChip cooling and thermal managementMicrostructure characterization (EBSD, Raman spectroscopy)

Publication output was minimal or absent before 2021 but has grown substantially since 2022, with a notable increase in output from 2024 through 2026.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 4.0/year recently
171819202021: 1 publication212022: 2 publications222023: 1 publication232024: 7 publications7242025: 5 publications252026: 5 publications26
Recent publications
Publishes in
  • Purdue×2
  • Journal of Applied Physics×1
  • Chemical Physics Letters×1
  • Langmuir×1
  • Flow×1
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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