Shuwei He
Engineering · The Ohio State University
Publications
41
Citations
274
Est. group size
—
Recurring co-author estimate
Active years
15
Publishing since 2012
Shuwei He's work focuses on advanced electronic packaging technologies, particularly through-silicon-via (TSV) and through-glass-via (TGV) interconnects used to build compact 3D and 2.5D integrated circuits for high-frequency and high-power electronics. Additional projects touch on battery materials for energy storage and, more recently, multi-modal AI systems for text-to-speech. The core body of work centers on the electrical, thermal, and mechanical reliability of chip-packaging interconnects.
Publication output dipped in the early 2020s but has picked up again in 2025-2026, suggesting renewed and increasing activity after a slower period.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Electro-Thermal Co-Design and Verification of TGV Transmission Structures for High-Power High-Frequency Applications
Micromachines · 2026
- Study on the High-Frequency Electrical Performance Degradation mechanism of RF TGV Transmission Structures During Temperature Cycling Tests Under High-Power and High-Temperature Conditions
2026
- MOF derived Co9S8 nanoparticles embedded in N-doped carbon sheets for enhanced sodium storage
Journal of Power Sources · 2025
- Research on high-power high-frequency electrical transmission characteristics of through glass via interconnections
Microelectronics Reliability · 2025
- Multi-Source Spatial Knowledge Understanding for Immersive Visual Text-to-Speech
2025
- Multi-modal and Multi-scale Spatial Environment Understanding for Immersive Visual Text-to-Speech
Proceedings of the AAAI Conference on Artificial Intelligence · 2025
- Electro-thermal Co-Design and Verification of TGV Transmission Structures for High-Power High-Frequency Applications
2025
- Thermal and Mechanical Properties Optimization of TGV Interposer for 2.5D Integrated Transceiver Based on ANN with Particle Swarm Optimization Algorithm
2025
- Multi-Source Spatial Knowledge Understanding for Immersive Visual Text-to-Speech
arXiv (Cornell University) · 2024
- Multi-modal and Multi-scale Spatial Environment Understanding for Immersive Visual Text-to-Speech
arXiv (Cornell University) · 2024
- Analytical Expression of Short Circuit Current for Virtual Synchronous Generator with Improved Low Voltage Ride Through Control Strategy
2023
- Dual carbon composited with Co9S8 through C-S bond as a high performance Binder-Free anode for Sodium-Ion batteries
Applied Surface Science · 2022
- A RF Redundant TSV Interconnection for High Resistance Si Interposer
Micromachines · 2021
- EEG-based Confusion Recognition Using Different Machine Learning Methods
2021 2nd International Conference on Artificial Intelligence and Computer Engineering (ICAICE) · 2021
- Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers
2020
- Micromachines×2
- arXiv (Cornell University)×2
- Nanoscale×1
- IEEE Transactions on Components Packaging and Manufacturing Technology×1
- Applied Surface Science×1
- Shuhang Lyu
Engineering · Purdue University West Lafayette
- Arvind Sundaram
Engineering · Purdue University West Lafayette
- Gerald Beyer
Engineering · The Ohio State University
- Chetan Jois
Engineering · Purdue University West Lafayette
- Fei Qin
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 19, 2026.
Claim or correct this profile