Xinkang Chen
Physics and Astronomy · Purdue University West Lafayette
Publications
37
Citations
102
Est. group size
~1
Recurring co-author estimate
Active years
45
Publishing since 1981
Xinkang Chen's recent work focuses on modeling electrical conductivity in the tiny metal wires (interconnects) that connect components inside computer chips, particularly how the wires' surfaces and grain boundaries scatter electrons and affect resistance. This work supports the design of next-generation chip wiring, including exploring new barrier materials like TaS2 to improve performance as wires shrink. Earlier work looked at defects (threading dislocations) in layered semiconductor materials used in electronic devices.
Publication output was intermittent through the mid-2010s and dipped to near zero around 2020-2022, but has picked up again with a cluster of related papers in 2023-2025.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Models for Spatially Resolved Conductivity of Rectangular Interconnects with Integrated Effect of Surface And Grain Boundary Scattering
arXiv (Cornell University) · 2025
- Erratum to “Spatially Resolved Conductivity of Rectangular Interconnects Considering Surface Scattering—Part I: Physical Modeling”
IEEE Transactions on Electron Devices · 2025
- Erratum to “Spatially Resolved Conductivity of Rectangular Interconnects Considering Surface Scattering—Part II: Circuit-Compatible Modeling”
IEEE Transactions on Electron Devices · 2025
- Circuit Implications of TaS <sub>2</sub> -Augmented Interconnects: A Temperature-Dependent Analysis
IEEE Transactions on Electron Devices · 2025
- Modeling of Via Resistance considering Spatially-Resolved Conductivity and Temperature-Dependence
2024
- Spatially Resolved Conductivity of Rectangular Interconnects Considering Surface Scattering—Part I: Physical Modeling
IEEE Transactions on Electron Devices · 2024
- Spatially Resolved Conductivity of Rectangular Interconnects Considering Surface Scattering—Part II: Circuit-Compatible Modeling
IEEE Transactions on Electron Devices · 2024
- Spatially Resolved Conductivity of Rectangular Interconnects considering Surface Scattering -- Part II: Circuit-Compatible Modeling
arXiv (Cornell University) · 2024
- Spatially Resolved Conductivity of Rectangular Interconnects considering Surface Scattering -- Part I: Physical Modeling
arXiv (Cornell University) · 2024
- The Impact of TaS$_{2}$-Augmented Interconnects on Circuit Performance: A Temperature-Dependent Analysis
arXiv (Cornell University) · 2024
- A Comprehensive Modeling Platform for Interconnect Technologies
IEEE Transactions on Electron Devices · 2023
- An interpretable model predicts visual outcomes of no light perception eyes after open globe injury
British Journal of Ophthalmology · 2023
- Modeling and Circuit Analysis of Interconnects with TaS<sub>2</sub> Barrier/Liner
2021
- Threading Dislocation Behavior in InGaAs/GaAs (001) Superlattice Buffer Layers
Selected topics in electornics and systems · 2020
- E-Coupon and Economic Performance of E-commerce
Shuju fenxi yu zhishi faxian · 2019
- IEEE Transactions on Electron Devices×6
- International Journal of High Speed Electronics and Systems×5
- Selected topics in electornics and systems×5
- arXiv (Cornell University)×4
- British Journal of Ophthalmology×1
- Paul R. Berger
Physics and Astronomy · The Ohio State University
- Steven A. Ringel
Physics and Astronomy · The Ohio State University
- J. Mirecki Millunchick
Physics and Astronomy · Indiana University
- Tyler J. Grassman
Physics and Astronomy · The Ohio State University
- Peter Y. Yu
Physics and Astronomy · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile