LabCompass

Xinkang Chen

Physics and Astronomy · Purdue University West Lafayette

Established · publishing since 1981Rising activity

Publications

37

Citations

102

Est. group size

~1

Recurring co-author estimate

Active years

45

Publishing since 1981

Research summary
AI-generated

Xinkang Chen's recent work focuses on modeling electrical conductivity in the tiny metal wires (interconnects) that connect components inside computer chips, particularly how the wires' surfaces and grain boundaries scatter electrons and affect resistance. This work supports the design of next-generation chip wiring, including exploring new barrier materials like TaS2 to improve performance as wires shrink. Earlier work looked at defects (threading dislocations) in layered semiconductor materials used in electronic devices.

Interconnect and via resistance modelingSurface and grain-boundary electron scatteringCircuit-compatible physical modeling for chip designSemiconductor heterostructure defects (threading dislocations)Novel interconnect materials (e.g., TaS2 barriers/liners)

Publication output was intermittent through the mid-2010s and dipped to near zero around 2020-2022, but has picked up again with a cluster of related papers in 2023-2025.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 2.4/year recently
2017: 2 publications172018: 5 publications182019: 5 publications192020: 1 publication202021: 1 publication21222023: 2 publications232024: 6 publications6242025: 4 publications2526
Recent publications
Publishes in
  • IEEE Transactions on Electron Devices×6
  • International Journal of High Speed Electronics and Systems×5
  • Selected topics in electornics and systems×5
  • arXiv (Cornell University)×4
  • British Journal of Ophthalmology×1
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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