LabCompass

Shubhra Bansal

Engineering · Purdue University West Lafayette

Established · publishing since 1973Rising activity

Publications

65

Citations

806

Est. group size

~3

Recurring co-author estimate

Active years

54

Publishing since 1973

Research summary
AI-generated

Shubhra Bansal's research spans microelectronics packaging reliability and solar energy materials, focusing on topics like copper microbump interconnects in stacked chip assemblies, thermal and mechanical degradation of solder joints, and halide perovskite materials for solar cells and photovoltaic recycling. The work combines materials characterization (X-ray imaging, Raman spectroscopy) with device-level testing to understand how electronic and solar components degrade over time and how to make manufacturing more sustainable.

3D chip packaging and interconnect reliabilityHalide perovskite materials for solar and optoelectronic devicesSolder and solder-alloy thermomechanical behaviorThin-film photovoltaic devices (CIGS, CdTe, perovskite)Sustainable/recyclable solar cell manufacturing

Publication output has grown over the last decade, rising from sporadic single papers in 2017-2019 to a steady 4-8 publications per year from 2022 through 2026.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 5.6/year recently
2017: 1 publication172018: 1 publication18192020: 7 publications202021: 1 publication212022: 4 publications222023: 5 publications232024: 7 publications242025: 8 publications8252026: 4 publications26
Recent publications
Publishes in
  • Solar RRL×3
  • physica status solidi (RRL) - Rapid Research Letters×2
  • Materials×2
  • Solar Energy×2
  • Preprints.org×2
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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