LabCompass

Tiwei Wei

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Mid career · publishing since 2012Rising activity
Heat Transfer and OptimizationHeat Transfer Mechanisms3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesHeat Transfer and Boiling Studies

Publications

91

Citations

882

Est. group size

~14

Recurring co-author estimate

Active years

15

Publishing since 2012

Research summary
AI-generated

Tiwei Wei's research focuses on thermal management and packaging for advanced electronics, including microchannel heat sinks, 3D chip integration, and cooling structures for high-power and high-density computing systems. The work combines materials engineering (e.g., copper, diamond composites, additive manufacturing) with heat transfer modeling to address cooling challenges in next-generation semiconductor packages and data centers. This is applied engineering research at the intersection of mechanical, materials, and electrical engineering.

Thermal management and heat sinks3D/2.5D chip packaging and interconnects (through-silicon and through-glass vias)Additive manufacturing of cooling structuresMicrostructural characterization of metals (e.g., copper)Data center and electronic system cooling

Publication output has grown substantially over the last decade, rising from about 1 paper per year in 2017 to roughly 14-19 per year in 2024-2026.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 13.6/year recently
2017: 1 publication172018: 2 publications182019: 8 publications192020: 4 publications202021: 2 publications212022: 6 publications222023: 11 publications232024: 14 publications242025: 19 publications19252026: 18 publications26
Recent publications
Publishes in
  • IEEE Transactions on Components Packaging and Manufacturing Technology×7
  • Journal of Electronic Packaging×7
  • International Journal of Heat and Mass Transfer×5
  • Applied Thermal Engineering×4
  • SSRN Electronic Journal×4
Similar researchers
By research-topic overlap

This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

Claim or correct this profile