Prabudhya Roy Chowdhury
Materials Science · Purdue University West Lafayette
Publications
26
Citations
647
Est. group size
~1
Recurring co-author estimate
Active years
11
Publishing since 2016
Prabudhya Roy Chowdhury works on heat transport and thermal management in advanced electronic packaging and materials, including 3D-stacked computer chips, thermal interface materials, and multilayer coatings. A recurring approach is combining computer simulations (like molecular dynamics) with machine learning to predict and optimize how heat moves through complex layered structures, such as those found in chiplets and superlattices. This work is aimed at helping design better cooling solutions for high-performance computing hardware.
Publication output has grown from occasional papers before 2020 to a steadier pace of roughly 3-5 per year since 2021, suggesting increasing research activity in recent years.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
arXiv (Cornell University) · 2026
- Fast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
2025
- Effective Medium Approximation in Investigating Heat Transfer Through Multiple Sandwiched Layers of BEOL Materials
2025
- Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
2025
- A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
2025
- Experimental Cross-Plane Thermal Transport
2025
- Machine learning-based design optimization of aperiodic multilayer coatings for enhanced solar reflection
International Journal of Heat and Mass Transfer · 2024
- Backside Power Distribution for Nanosheet Technologies Beyond 2nm
2024
- Fast and accurate machine learning prediction of phonon scattering rates and lattice thermal conductivity
npj Computational Materials · 2023
- Machine Learning Designed and Experimentally Confirmed Enhanced Reflectance in Aperiodic Multilayer Structures
Advanced Optical Materials · 2023
- Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
2023
- Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
2023
- A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
2023
- Unexpected thermal conductivity enhancement in aperiodic superlattices discovered using active machine learning
npj Computational Materials · 2022
- Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022
- npj Computational Materials×2
- Journal of Power Sources×2
- arXiv (Cornell University)×2
- Nature Catalysis×1
- Nature Communications×1
- Zexi Lu
Materials Science · Purdue University West Lafayette
- Xiaolong Yang
Materials Science · Purdue University West Lafayette
- Zherui Han
Materials Science · Purdue University West Lafayette
- Xiulin Ruan
Materials Science · Purdue University West Lafayette
- Mauricio Segovia
Materials Science · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile