LabCompass

Zhengwei Chen

Engineering · Purdue University West Lafayette

OpenAlex
Early career · publishing since 2020
Electronic Packaging and Soldering TechnologiesMicrofluidic and Bio-sensing Technologies3D IC and TSV technologiesElectrowetting and Microfluidic TechnologiesNanofluid Flow and Heat Transfer

Publications

10

Citations

14

Est. group size

~2

Recurring co-author estimate

Active years

7

Publishing since 2020

Research summary
AI-generated

Zhengwei Chen works in engineering, focusing on electronic packaging technologies such as microbumps (tiny solder connections used to link stacked computer chips) and heat transport in these small-scale structures. The research also touches on related areas like microfluidics (manipulating tiny amounts of fluid) and 3D integrated circuit technologies, which are used to build compact, layered electronic devices.

Electronic packaging and soldering3D chip stacking (TSV) technologiesMicrobump thermal transportMicrofluidics and bio-sensingNanofluid heat transfer

Publication output was minimal or absent in the earlier part of the decade but has increased noticeably in the most recent few years, suggesting growing research activity.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 1.6/year recently
1718192020: 1 publication202021: 1 publication21222023: 1 publication232024: 3 publications3242025: 1 publication252026: 3 publications326
Recent publications
Publishes in
  • Elsevier eBooks×2
  • Journal of Electronic Packaging×2
  • Electrophoresis×1
  • Scientific Reports×1
  • Bulletin of the American Physical Society×1
Similar researchers
By research-topic overlap

This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

Claim or correct this profile