PI directory

11 principal investigators, auto-profiled from public data.

Filtering by topic Copper Interconnects and Reliability — clear

Materials Science · The Ohio State University · active through 2026

Microstructure and mechanical propertiesMetal and Thin Film MechanicsShape Memory Alloy TransformationsActiveEstablished

Engineering · Purdue University West Lafayette · active through 2026

Electronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure Properties3D IC and TSV technologiesActiveEstablished

Engineering · The Ohio State University · active through 2026

3D IC and TSV technologiesCopper Interconnects and ReliabilitySemiconductor materials and devicesVery activeEstablished

Engineering · Purdue University West Lafayette · active through 2026

Electronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityHigh-Temperature Coating BehaviorsSelective outputMid career

Engineering · Purdue University West Lafayette · active through 2026

3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityActiveEarly career

Physics and Astronomy · The Ohio State University · active through 2025

Force Microscopy Techniques and ApplicationsGas Sensing Nanomaterials and SensorsSemiconductor materials and devicesActiveEstablished

Engineering · The Ohio State University · active through 2025

Silicon Carbide Semiconductor TechnologiesSemiconductor materials and devicesCopper Interconnects and ReliabilityActiveMid career

Engineering · Purdue University West Lafayette · active through 2025

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and ReliabilitySelective outputEarly career

Physics and Astronomy · Purdue University West Lafayette · active through 2025

Semiconductor Quantum Structures and DevicesSemiconductor materials and devicesCopper Interconnects and ReliabilityActiveEstablished

Engineering · Purdue University West Lafayette · active through 2025

Electronic Packaging and Soldering TechnologiesCopper Interconnects and ReliabilityAdvanced Numerical Analysis TechniquesSelective outputEarly career

Engineering · The Ohio State University · active through 2024

Semiconductor materials and devicesCopper Interconnects and ReliabilityMetal and Thin Film MechanicsSelective outputMid career