LabCompass

John E. Blendell

Engineering · Purdue University West Lafayette

OpenAlex ORCID
Established · publishing since 1976Rising activity
Electronic Packaging and Soldering TechnologiesFerroelectric and Piezoelectric MaterialsPhysics of Superconductivity and MagnetismAdvanced ceramic materials synthesisAcoustic Wave Resonator Technologies

Publications

167

Citations

3,269

Est. group size

~5

Recurring co-author estimate

Active years

51

Publishing since 1976

Research summary
AI-generated

John E. Blendell works on the properties and reliability of materials used in electronics and structural applications, including lead-free solder alloys, ferroelectric and piezoelectric ceramics, and grain structure in polycrystalline materials. Much of the work involves testing how these materials behave under mechanical stress (such as drop shock, thermal cycling, and nanoindentation) and electrical fields (such as domain switching and Barkhausen noise). The research combines experimental materials characterization with applications relevant to electronic packaging and device reliability.

Lead-free solder alloys and electronic packaging reliabilityFerroelectric and piezoelectric ceramic materialsGrain growth and microstructure in polycrystalline materialsMechanical testing (nanoindentation, drop shock, thermal cycling)Domain switching and Barkhausen noise in ferroelectrics

Publication output has been fairly steady over the past decade with some year-to-year variation, showing a modest increase in activity in the most recent few years compared to the middle of the decade.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 4.0/year recently
2017: 2 publications172018: 2 publications182019: 2 publications192020: 7 publications7202021: 2 publications212022: 1 publication222023: 5 publications232024: 6 publications242025: 5 publications252026: 3 publications26
Recent publications
Publishes in
  • SMTA International×4
  • Acta Materialia×3
  • Journal of Electronic Materials×3
  • MRS Advances×2
  • Scripta Materialia×2
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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