Huan Wu
Engineering · Purdue University West Lafayette
Publications
105
Citations
2,178
Est. group size
—
Recurring co-author estimate
Active years
30
Publishing since 1996
This publication record appears to combine work from multiple researchers sharing the name Huan Wu, spanning power semiconductor device engineering (especially silicon carbide MOSFETs and IGBTs), nursing/medical education studies, and biomedical topics like cancer nanomedicine and reproductive toxicology. The most consistent technical thread concerns the reliability and failure behavior of power electronics devices, particularly short-circuit and avalanche ruggedness in SiC and silicon-based transistors used in power conversion systems.
Publication output has grown over the last decade, rising from single digits in 2017-2021 to 11-16 papers per year in 2022-2025, indicating an increasing publication rate, though the mixed subject matter suggests the count may reflect multiple same-named authors.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Growth mindset mediates the effect of core self-evaluation on professional self-efficacy for nursing interns: A cross-sectional study
Nurse Education Today · 2025
- Investigation on Short-Circuit Characteristics and Failure Modes of SiC Planar MOSFETs With Linear and Hexagonal Topologies
IEEE Journal of Emerging and Selected Topics in Power Electronics · 2025
- Association of ZWINT Expression with Clinicopathologic Characteristics and Prognosis in Breast Cancer Patients
Current Medical Science · 2025
- Ultrasound-Visualized Cuproptosis in Glioblastoma via Endogenous Copper Sequestration and Nitric Oxide-Gas Controlled Release Using a Programmable Nanoliposomal Platform
ACS Nano · 2025
- An investigation of how circuit parameters affect the short-circuit type 2 ruggedness in FS-IGBT
Microelectronics Journal · 2025
- Visible‐Light‐Driven Selective Mineralization of Organohalides on Spatially Close Au Single‐Atom and Nanocluster Neighbors Over Poly(Heptazine Imides)
Angewandte Chemie · 2025
- Effects of inter-group contact training on aging-related stereotypes among undergraduate nursing students: a randomized controlled trial
Gerontology & Geriatrics Education · 2025
- Dynamic avalanche reliability enhancement of FS-IGBT under unclamped inductive switching
Journal of Semiconductors · 2025
- Performance and surge capacity evaluations of 1.2kV SiC VDMOSFETs with varied JFET width
Materials Science in Semiconductor Processing · 2025
- RETRACTED: Zhang et al. Effects of Current Filaments on IGBT Avalanche Robustness: A Simulation Study. Electronics 2024, 13, 2347
Electronics · 2025
- Design and Fabrication of FS-IGBTs With Enhanced Ruggedness and the Influence of Circuit Parameters on Short-Circuit
IEEE Transactions on Device and Materials Reliability · 2025
- Phase Current Reconstruction Control Strategy of Dual Three-Phase Permanent Magnet Synchronous Motor Based on Single Current Sensor
2025
- Effect of annealing processing on microstructure and texture of 20-μm-thick CuNi precision resistance alloy foil
Journal of Physics Conference Series · 2025
- Realistic dose of 6:2 Cl-PFESA and PFHxS induce asthenospermia and impair the blood-testis barrier: Characterization of mixture effect in Mus musculus
SSRN Electronic Journal · 2025
- Immobilization of alcalase on polydopamine modified magnetic particles
Biochemical Engineering Journal · 2024
- SSRN Electronic Journal×10
- Innate Immunity×3
- Materials science forum×3
- 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)×3
- Journal of Animal Science×2
- Michael Jin
Engineering · The Ohio State University
- Hengyu Yu
Engineering · The Ohio State University
- Dallas Morisette
Engineering · Purdue University West Lafayette
- Limeng Shi
Engineering · The Ohio State University
- Monikuntala Bhattacharya
Engineering · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile