Anant Agarwal
Engineering · The Ohio State University
Publications
711
Citations
24,809
Est. group size
~20
Recurring co-author estimate
Active years
46
Publishing since 1981
This researcher's work centers on silicon carbide (SiC) power electronics, including the design, testing, and reliability of SiC MOSFETs and power devices used in high-voltage circuits and converters. The publication record also includes a separate cluster of papers on data analytics, machine learning applications, and program/project management topics, suggesting either a broad set of interests or contributions from a large, diverse research group. Prospective students would likely engage with hands-on hardware characterization and device testing work in power electronics, alongside possible opportunities in applied data science projects.
Publication output grew substantially from near zero in 2017-2018 to a sustained pace of about 12-20 papers per year from 2021 onward, indicating an active and expanding research output over the last decade.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Technique for the Accurate Measurement of Average dv/dt of SiC MOSFET
2026
- Switching Loss Characterization with Uncertainty Quantification for 3.3 kV Monolithic Versus Discrete SiC Bidirectional FETs
2026
- Risk Migration in Agile Program Management: A Systematic Review of Current Mitigation Approaches
International Journal of Computer Applications · 2025
- Customer Analytics: Using Machine Learning to Predict the Customer Life Time Value (CLTV) Based on Purchase History and Ratings
2025
- TRANSFORMING CUSTOMER EXPERIENCE THROUGH NLP AND SENTIMENT ANALYSIS
International Journal of Data Mining & Knowledge Management Process · 2025
- Investigation of Screening Methods for 1.2 kV 4H-SiC MOSFETs Using High Gate Voltage Pulses and Unclampled Inductive Switching
2025
- Program Management in AI-Powered Retail Transformation: A Review Paper
2025
- Implementation of WBG devices in circuits - Electric Drive Technologies Project (Final Technical Report)
2025
- THE VANISHING HERITAGE OF AGRA, INDIA THE SALE OF THE TAJ MAHAL
Journal of the Pakistan Historical Society · 2025
- Device Performance and Reliability of SiC CMOS up to 400°C
Key engineering materials · 2025
- Frameworks for Data Management in Modern Enterprises: Enhancing Predictive Analytics and Process Optimization
Lecture notes in networks and systems · 2025
- Silicon Carbide materials and devices: power electronics and innovative applications
Materials Science in Semiconductor Processing · 2024
- Impact of Operational Parameters on dV<sub>DS</sub>/dt of SiC MOSFET and a Scheme for Gate Driver Resistance Selection to Limit dV<sub>DS</sub>/dt
2024
- Adaptive Traffic Signal Cycle Control for Green City Traffic Management
2024
- Integrating Multimodal Recognition for Smart Load Management and Spoof Detection in Residential Environments
2024
- IEEE Transactions on Electron Devices×5
- Electronics×4
- Materials Science in Semiconductor Processing×3
- Materials×3
- 2022 IEEE International Reliability Physics Symposium (IRPS)×3
- Monikuntala Bhattacharya
Engineering · The Ohio State University
- Tianshi Liu
Engineering · The Ohio State University
- Hengyu Yu
Engineering · The Ohio State University
- Dallas Morisette
Engineering · Purdue University West Lafayette
- Jiasheng Yan
Engineering · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 19, 2026.
Claim or correct this profile