Srivathsan Sudhakar
Engineering · Purdue University West Lafayette
Publications
13
Citations
287
Est. group size
~1
Recurring co-author estimate
Active years
10
Publishing since 2016
Srivathsan Sudhakar's research focuses on thermal management technologies for high-power electronics, particularly vapor chambers and evaporator wicks that use boiling and capillary action to remove large amounts of heat from small areas. The work combines experimental testing with modeling to understand boiling behavior, dryout limits, and heat dissipation performance in cooling devices used for high-heat-flux applications like computer chips.
Publication output has been intermittent over the last decade, with a cluster of activity in 2019 followed by gaps and a modest resumption in 2024-2025.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- A methodology to predict the power dissipation limits of high-heat-flux vapor chambers considering boiling in the evaporator
International Journal of Heat and Mass Transfer · 2025
- Experimental investigation of post and vented vapor chamber designs for high heat flux dissipation
International Journal of Heat and Mass Transfer · 2024
- Thermal Performance of a Pump-Assisted Capillary Loop Cooler
Journal of Thermal Science and Engineering Applications · 2024
- A semi-empirical model for thermal resistance and dryout during boiling in thin porous evaporators fed by capillary action
International Journal of Heat and Mass Transfer · 2021
- Investigation of boiling behaviors in vapor chambers in response to transient heat input profiles
Applied Thermal Engineering · 2021
- Thermal Performance Evaluation of a Two-Layer Wick Vapor Chamber for High Heat Flux Dissipation by Air Cooling
2020
- Area-scalable high-heat-flux dissipation at low thermal resistance using a capillary-fed two-layer evaporator wick
International Journal of Heat and Mass Transfer · 2019
- Experimental investigation of boiling regimes in a capillary-fed two-layer evaporator wick
International Journal of Heat and Mass Transfer · 2019
- The role of vapor venting and liquid feeding on the dryout limit of two-layer evaporator wicks
International Journal of Heat and Mass Transfer · 2019
- Design of an Area-Scalable Two-Layer Evaporator Wick for High-Heat-Flux Vapor Chambers
IEEE Transactions on Components Packaging and Manufacturing Technology · 2019
- Transient Analysis of Nonuniform Heat Input Propagation Through a Heat Sink Base
Journal of Electronic Packaging · 2017
- An area-scalable two-layer evaporator wick concept for high-heat-flux vapor chambers
2017
- Transient Analysis of Non-Uniform Heat Input Propagation Through a Heat Sink Base
2016
- International Journal of Heat and Mass Transfer×6
- Journal of Electronic Packaging×1
- Journal of Thermal Science and Engineering Applications×1
- IEEE Transactions on Components Packaging and Manufacturing Technology×1
- Applied Thermal Engineering×1
- Peter O’Kelly
Engineering · The Ohio State University
- Md Emadur Rahman
Engineering · Purdue University West Lafayette
- Manohar Bongarala
Engineering · Purdue University West Lafayette
- Justin A. Weibel
Engineering · Purdue University West Lafayette
- Issam Mudawar
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
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