Manohar Bongarala
Engineering · Purdue University West Lafayette
Publications
17
Citations
86
Est. group size
~2
Recurring co-author estimate
Active years
6
Publishing since 2021
Manohar Bongarala works on thermal management for electronics and data centers, focusing on how liquids boil and evaporate to remove heat from computer chips and servers. Recent work covers two-phase cooling systems (where a liquid partially turns to vapor to carry away heat more efficiently), microchannel heat sinks, and immersion or liquid cooling for high-power GPUs and AI data center hardware. This research combines experiments, imaging, and some data-driven (machine learning) analysis to understand and improve heat transfer processes like boiling and evaporation.
Publication output was minimal or absent in the mid-2010s to early 2020s but has increased noticeably from 2024 through 2026, suggesting a recent growth phase.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Special Section on Silicon-Package-Rack-Data Center Thermal Management: Challenges, Opportunities, and Solutions
Journal of Electronic Packaging · 2026
- Thin-Film Lithium Niobate Hybrid Integration for Co-packaged Optics
2026
- Identification of Local Dryout Signatures in Two-Phase Microchannel Heat Sinks Using a Multi-Chip Module Thermal Test Vehicle
2026
- Immersion-cooled 1U power supply unit for fanless, warm-liquid-cooled data centers
Applied Thermal Engineering · 2026
- Experimental Characterization of a Low Thermal Resistance Microchannel Heatsink Utilizing Low GWP Refrigerant for High Power GPU Applications
2025
- Experimental Demonstration of High-Power Thermal Test Vehicle using Two-Phase Cooling for AI Datacenters, 5G RAN, and Edge Compute Nodes
2025
- Corrigendum to “Boiling crisis is a consequence of thermal runaway in the substrate due to degradation of nucleate boiling heat transfer” [Int. J. Heat Mass Trans. (2024) 125906]
International Journal of Heat and Mass Transfer · 2025
- Generalizable Physical Descriptors of Pool Boiling Heat Transfer from Unsupervised Learning of Images
SSRN Electronic Journal · 2025
- Generalizable physical descriptors of pool boiling heat transfer from unsupervised learning of images
International Journal of Heat and Mass Transfer · 2025
- Thermofluidic Performance of a Two-Phase Loop Thermosyphon for Server Cooling: Effects of Condenser Secondary Side
2025
- Boiling crisis is a consequence of thermal runaway in the substrate due to degradation of nucleate boiling heat transfer
International Journal of Heat and Mass Transfer · 2024
- A method to partition boiling heat transfer mechanisms using synchronous through-substrate high-speed visual and infrared measurements
International Journal of Heat and Mass Transfer · 2024
- Microlayer evaporation governs heat transfer enhancement during pool boiling from microstructured surfaces
Applied Physics Letters · 2022
- Finding Novel Links in COVID-19 Knowledge Graph Using Graph Embedding Techniques
Communications in computer and information science · 2022
- A figure of merit to characterize the efficacy of evaporation from porous microstructured surfaces
International Journal of Heat and Mass Transfer · 2021
- International Journal of Heat and Mass Transfer×5
- Applied Physics Letters×1
- Communications in computer and information science×1
- SSRN Electronic Journal×1
- Journal of Electronic Packaging×1
- Yanbo Huang
Engineering · Purdue University West Lafayette
- Rishav Roy
Engineering · Purdue University West Lafayette
- Suresh V. Garimella
Engineering · Purdue University West Lafayette
- Justin A. Weibel
Engineering · Purdue University West Lafayette
- Issam Mudawar
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
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