LabCompass

Rishav Roy

Engineering · Purdue University West Lafayette

Mid career · publishing since 2015Rising activity

Publications

24

Citations

102

Est. group size

~1

Recurring co-author estimate

Active years

12

Publishing since 2015

Research summary
AI-generated

Rishav Roy works on thermal management engineering, focusing on how heat moves through and away from electronic devices and materials. Recent work centers on two-phase cooling (using boiling/evaporation) for high-power electronics such as AI data centers, 5G equipment, and 3D integrated circuits, as well as related topics like oscillating heat pipes, microchannel evaporators, droplet behavior on surfaces, and salt evaporation patterns in porous materials.

Two-phase and boiling heat transfer for electronics coolingThermal management of data centers and high-power chipsOscillating heat pipes and microchannel cooling devicesSurface wetting, superhydrophobicity, and droplet behaviorPorous media evaporation and efflorescence modeling

Publication output was low and sporadic from 2017-2023 but has grown notably in 2024-2026, suggesting increasing recent research activity.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 3.6/year recently
172018: 1 publication182019: 2 publications192020: 2 publications20212022: 2 publications222023: 2 publications232024: 5 publications242025: 6 publications6252026: 3 publications26
Recent publications
Publishes in
  • International Journal of Heat and Mass Transfer×2
  • Advanced Materials Interfaces×2
  • Communications Engineering×1
  • Langmuir×1
  • 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)×1
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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