Rishav Roy
Engineering · Purdue University West Lafayette
Publications
24
Citations
102
Est. group size
~1
Recurring co-author estimate
Active years
12
Publishing since 2015
Rishav Roy works on thermal management engineering, focusing on how heat moves through and away from electronic devices and materials. Recent work centers on two-phase cooling (using boiling/evaporation) for high-power electronics such as AI data centers, 5G equipment, and 3D integrated circuits, as well as related topics like oscillating heat pipes, microchannel evaporators, droplet behavior on surfaces, and salt evaporation patterns in porous materials.
Publication output was low and sporadic from 2017-2023 but has grown notably in 2024-2026, suggesting increasing recent research activity.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- High Power, Locker-Free, Compact Hybrid Integrated Tunable Laser
Journal of Lightwave Technology · 2025
- Low-Cost Transceiver Integration for Next Generation Passive Optical Network
2025
- High Power Thermal Test Vehicle with 2-Phase Cooling for AI Datacenters, 5G RAN, and EDGE Compute Nodes
2024
- An Integrated Simulation Framework for Thermal-Mechanical Performance Analysis of Two-phase Microchannel Evaporators
2024
- Experimental investigation of the heat spreading performance of oscillating heat pipes for electronics cooling applications
2024
- Surace-Enhanced Two-Phase Cold Plate Designs for High Power Dissipation in Data Centers
2024
- Dependence of Oscillation Frequencies on Operating Conditions in an Oscillating Heat Pipe
2024
- An exclusion distance controls the efflorescence pattern distribution on porous media during salt solution evaporation
International Journal of Heat and Mass Transfer · 2023
- Grey Wolf Optimization Based Maximum Power Point Tracking Algorithm for Partially Shaded Photovoltaic Modules in Wireless Battery Charging Application
Communications in computer and information science · 2023
- Modeling the formation of efflorescence and subflorescence caused by salt solution evaporation from porous media
International Journal of Heat and Mass Transfer · 2022
- Co-design of Thermal Management with System Architecture and Power Management for 3D ICs
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022
- Droplets on Soft Surfaces Exhibit a Reluctance to Coalesce due to an Intervening Wetting Ridge
Advanced Materials Interfaces · 2020
- Soft Surface: Droplets on Soft Surfaces Exhibit a Reluctance to Coalesce due to an Intervening Wetting Ridge (Adv. Mater. Interfaces 17/2020)
Advanced Materials Interfaces · 2020
- Diagnosing clinical depression from voice: Using Signal Processing and Neural Network Algorithms to build a Mental Wellness Monitor
2019
- Re-entrant Cavities Enhance Resilience to the Cassie-to-Wenzel State Transition on Superhydrophobic Surfaces during Electrowetting
Langmuir · 2018
- International Journal of Heat and Mass Transfer×2
- Advanced Materials Interfaces×2
- Communications Engineering×1
- Langmuir×1
- 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)×1
- Suresh V. Garimella
Engineering · Purdue University West Lafayette
- Manohar Bongarala
Engineering · Purdue University West Lafayette
- Yanbo Huang
Engineering · Purdue University West Lafayette
- Justin A. Weibel
Engineering · Purdue University West Lafayette
- Issam Mudawar
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
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