Hua Bao

Materials Science · University of Michigan

Established · publishing since 1996Rising activity

Thermal properties of materials Thermal Radiation and Cooling Technologies Advanced Thermoelectric Materials and Devices Lung Cancer Treatments and Mutations Graphene research and applications

Publications

313

Citations

11,073

Est. group size

—

Recurring co-author estimate

Active years

Publishing since 1996

In context

Among 455 established Materials Science PIs within our index

Citations: 11,073cohort median 3,285

Publications / year (recent): 28.0cohort median 4.8

Typically publishes in teams of ~6 · 19% small-team papers (≤3 authors) · across 95 venues

Publication cadence

Publications per year over the last 10 years — averaging 28.0/year recently

Collaborators per year

Distinct co-authors at University of Michigan each year — a rough indication of whether the group around this researcher has been growing or contracting. An estimate from co-authorship, not a roster: collaborators are not necessarily lab members, and recent years can be under-counted while indexing catches up.

Recent publications

Phonon-mediated thermal transport in two-dimensional <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML"> <mml:msub> <mml:mi>MoSe</mml:mi> <mml:mn>2</mml:mn> </mml:msub> </mml:math> at cryogenic temperatures from accelerated <i>ab initio</i> calculations
Physical review. B./Physical review. B · 2026
Large-scale implementation of solar interfacial desalination
Nature Sustainability · 2025
Electrically-driven reversible phonon transport manipulation in two-dimensional heterostructures
Nature Communications · 2025
Direct Observation of Substantial Phonon Nonequilibrium Near Nanoscale Hotspots in Gallium Nitride
Advanced Science · 2025
Lattice thermal conductivity of 16 elemental metals from molecular dynamics simulations with a unified neuroevolution potential
Journal of Applied Physics · 2025
Phonon Olympics: Phonon property and lattice thermal conductivity benchmarking from open-source packages
Journal of Applied Physics · 2025
Non-Fourier thermal analysis of the self-heating effect in CMOS logic circuits
APL Electronic Devices · 2025
Dealing with coupling effect for accurate thermal profile prediction of BEOL interconnect in advanced technology nodes
APL Electronic Devices · 2025
Isovalent Doping Reduces Channel Temperature Within Nanoscale Devices
IEEE Transactions on Electron Devices · 2025
Design of low-thickness random nanoparticle coatings for radiative cooling using particle swarm optimization
International Journal of Thermal Sciences · 2025
Multiscale Thermal Simulation for GAAFET With First-Principles-Based Boltzmann Transport Equation
IEEE Transactions on Electron Devices · 2025
Graphene Paper‐Based Multilayer Thermally Conductive Tapes with Exceptional Electrical Insulation for High Heat Flux Dissipation
Advanced Functional Materials · 2025
Optimizing the distiller structural design for solar interfacial desalination
Desalination · 2025
EGFR A859S alteration may predict a better response to third-generation EGFR-TKI treatment in advanced NSCLC
Genes & Diseases · 2025
An ab initio dataset of size-dependent effective thermal conductivity for advanced technology transistors
arXiv (Cornell University) · 2025

Publishes in

arXiv (Cornell University)×18
Physical review. B./Physical review. B×16
Journal of Applied Physics×8
Cancer Research×8
International Journal of Heat and Mass Transfer×7

Similar researchers

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Yuxuan Luan
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Zherui Han
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Zexi Lu
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 25, 2026.

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