Cih Cheng
Engineering · Purdue University West Lafayette
Publications
12
Citations
69
Est. group size
~2
Recurring co-author estimate
Active years
12
Publishing since 2015
Cih Cheng works in engineering topics related to advanced materials and fabrication, including graphene-polymer composite heaters, micro hot embossing (a technique for shaping polymer surfaces at small scales), and studies of material behavior in electronic packaging. Publications also touch on 3D printing, biosensing, and nanofabrication techniques, suggesting an interest in materials and manufacturing processes for small-scale devices.
Publication output has been low but fairly steady over the last decade, averaging about one to two papers per year with some gaps.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Experimental Studies of Assembly Material Creep Behaviors and The Impact to Package Warpage
2026
- A novel flexible heating element using graphene polymeric composite ink on polyimide film
Microsystem Technologies · 2018
- Application of graphene–polymer composite heaters in gas-assisted micro hot embossing
RSC Advances · 2017
- ガスアシストマイクロホットエンボス加工におけるグラフェン‐高分子複合材料加熱器の応用【Powered by NICT】
RSC Advances (Web) · 2017
- International Journal of Heat and Mass Transfer×2
- Advanced Science×2
- Med-X×1
- Microsystem Technologies×1
- RSC Advances×1
- Sae Rome Choi
Engineering · Purdue University West Lafayette
- Yi Zhao
Engineering · The Ohio State University
- Julia Walsh
Engineering · Purdue University West Lafayette
- Karthikeyan Subbiahanadar Chelladurai
Engineering · Purdue University West Lafayette
- Aleksander Skardal
Engineering · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile