Serdar Ozguc
Engineering · Purdue University West Lafayette
Publications
13
Citations
271
Est. group size
~2
Recurring co-author estimate
Active years
6
Publishing since 2019
Serdar Ozguc works on designing better heat sinks and cooling devices for electronics, using computational methods called topology optimization to figure out the most effective internal shapes and channel layouts for removing heat. Much of this work combines mathematical modeling with 3D printing (additive manufacturing) to build and experimentally test these optimized cooling parts, including for microchannel heat sinks, two-phase (boiling) cooling systems, and cold plates for computer chips.
Publication output was minimal before 2021, then increased with a notable burst in 2021 followed by steady smaller output of a few papers per year through 2024.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Experimental investigation of an additively manufactured cold plate for multi-chip module cooling generated using the homogenization approach to topology optimization
Applied Thermal Engineering · 2024
- An approach for topology optimization of heat sinks for two-phase flow boiling: Part 1 – Model formulation and numerical implementation
Applied Thermal Engineering · 2024
- An approach for topology optimization of heat sinks for two-phase flow boiling: Part 2 – Model calibration and experimental validation
Applied Thermal Engineering · 2024
- Experimental study of topology optimized, additively manufactured microchannel heat sinks designed using a homogenization approach
International Journal of Heat and Mass Transfer · 2023
- Topological optimization of flow-shifting microchannel heat sinks
International Journal of Heat and Mass Transfer · 2023
- An Approach for Topology Optimization of Heat Sinks for Two-Phase Flow Boiling
SSRN Electronic Journal · 2023
- Topology Optimization of an Air-Cooled Heat Sink for Transient Heat Dissipation using a Homogenization Approach
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) · 2022
- Topology Optimization of Microchannel Heat Sinks Using a Homogenization Approach
2021
- Topology optimization of microchannel heat sinks using a homogenization approach
International Journal of Heat and Mass Transfer · 2021
- Optimization of permeable membrane microchannel heat sinks for additive manufacturing
Applied Thermal Engineering · 2021
- Topology Optimization of Microchannel Heat Sinks Using a Homogenization Approach
2021
- Topology Optimization of Microchannel Heat Sinks Using a Homogenization Approach
2021
- Experimental Demonstration of an Additively Manufactured Vapor Chamber Heat Spreader
2019
- Applied Thermal Engineering×4
- International Journal of Heat and Mass Transfer×3
- 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)×1
- SSRN Electronic Journal×1
- Joel C. Najmon
Engineering · Purdue University West Lafayette
- Andrés Tovar
Engineering · Purdue University West Lafayette
- Neal Patel
Engineering · Purdue University West Lafayette
- Prathamesh Chaudhari
Computer Science · Purdue University West Lafayette
- Daniel Raphael Ejike Ewim
Engineering · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile