LabCompass

Milan Heczko

Engineering · The Ohio State University

Mid career · publishing since 2010Rising activity

Publications

90

Citations

1,478

Est. group size

~10

Recurring co-author estimate

Active years

17

Publishing since 2010

Research summary
AI-generated

Milan Heczko's research focuses on the microstructure and mechanical behavior of advanced metal alloys, particularly high-temperature alloys, high-entropy and multi-principal-element alloys, and superalloys used in demanding structural applications. Work includes studying how materials deform, resist creep (slow deformation under stress at high temperature), and fatigue, as well as how manufacturing methods like 3D printing affect alloy properties. Note that some listed items (archaeological artifact records in Czech) appear unrelated to this engineering research and may reflect a data-source mixing issue rather than the researcher's actual work.

High-temperature alloys and creep behaviorHigh-entropy and multi-principal-element alloysMicrostructure-property relationships in metalsFatigue and fracture mechanicsAdditive manufacturing of metal alloys

Publication output was relatively steady at 3-8 per year from 2017-2023, then increased sharply to 14-19 per year in 2024-2025, indicating a recent growth phase.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 9.6/year recently
2017: 4 publications172018: 5 publications182019: 3 publications192020: 4 publications202021: 8 publications212022: 3 publications222023: 5 publications232024: 19 publications19242025: 14 publications252026: 7 publications26
Recent publications
Publishes in
  • Open MIND×19
  • Acta Materialia×9
  • Materials Science and Engineering A×6
  • SSRN Electronic Journal×5
  • Microscopy and Microanalysis×4
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 19, 2026.

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