M. Asaduz Zaman Mamun
Engineering · Purdue University West Lafayette
Publications
18
Citations
124
Est. group size
~1
Recurring co-author estimate
Active years
8
Publishing since 2019
This researcher works on the reliability and failure mechanisms of electronic packaging and integrated circuits, especially under extreme conditions like radiation, high temperature, and humidity. Their work spans topics such as wirebond corrosion, chip-package reliability in advanced 3D-stacked electronics, and radiation-hardened neural network chips, with some earlier work on terahertz devices using graphene and other nanomaterials. This research area is relevant to students interested in making electronics more robust for use in space, defense, and other harsh environments.
Publication output was minimal before 2022 but has grown noticeably since, peaking with five papers in both 2023 and 2024 before tapering slightly in 2025-2026.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Radiation-Resilient SOI LIF Spiking Neural Networks With Dynamic Error Recovery in Harsh TID-HCI Environment
IEEE Transactions on Electron Devices · 2026
- Wirebond Corrosion Failure of Plastic Packages in Extreme Environments: Theory and Experiment
IEEE Transactions on Components Packaging and Manufacturing Technology · 2025
- Demystifying the Use of IC Plastic packages for Space Applications
2025
- Electrical Chip-Package-Board Reliability of 2.5-D/3-D HI Packaged Systems: A Perspective
IEEE Transactions on Electron Devices · 2024
- Leakage current as a probe into the mechanics of carrier transport in insulating composite polymers
Journal of Applied Physics · 2024
- Tunable multistate terahertz switch based on multilayered graphene metamaterial
Optical and Quantum Electronics · 2023
- A Universal Scaling Formulation of the Generalized Peck’s Equation for Corrosion Limited Lifetime in Self-Heated ICs
IEEE Transactions on Components Packaging and Manufacturing Technology · 2023
- Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures
2023
- Cross-coupled Self-Heating and Consequent Reliability Issues in GaN-Si Hetero-integration: Thermal Keep-Out-Zone Quantified
2023
- A Holistic Approach to Predict Wirebond Corrosion Failure in Extreme Operating Environments
2023
- Reduced Relative Humidity (RH) Enhances the Corrosion-Limited Lifetime of Self-Heated IC: Peck’s equation Generalized
2022 IEEE International Reliability Physics Symposium (IRPS) · 2022
- Tunable Multistate Terahertz Switch Based on Multilayered Graphene Metamaterial
Figshare · 2022
- Terahertz polarizer based on tunable surface plasmon in graphene nanoribbon
Optics Express · 2021
- Effects of Anti-reflection Coating and Plasmonic Nanoparticle on the Performance Characteristics of Three Terminal Bipolar Transistor Architecture Based Solar Cell
2020
- Rate Equation-based Modeling of Steady-state and Transient Performance Characteristics and High Frequency Modulation Response of Single Layer Transition metal Dichalcogenide Excitonic Lasers
2019
- IEEE Transactions on Electron Devices×3
- IEEE Transactions on Components Packaging and Manufacturing Technology×2
- Optics Express×1
- Matter×1
- Optical and Quantum Electronics×1
- SangHoon Shin
Engineering · Purdue University West Lafayette
- Muhammad Masuduzzaman
Engineering · Purdue University West Lafayette
- Marvin H. White
Engineering · The Ohio State University
- Muhammad A. Alam
Engineering · Purdue University West Lafayette
- M. J. Kim
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile