K.T. Chiang
Engineering · Purdue University West Lafayette
Publications
41
Citations
524
Est. group size
—
Recurring co-author estimate
Active years
47
Publishing since 1980
K.T. Chiang works in engineering, focusing on how metals used in electronics behave and fail under stress, heat, and corrosion. Recent work uses computer simulations to study things like cracking in microelectronic connectors and structural changes in solder materials used to join electronic components during repeated heating and cooling.
Publication output has been minimal and sporadic over the last decade, with only two recorded publications, both very recent (2024 and 2026).
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling
Journal of Electronic Materials · 2026
- Corrosion-induced fracture of Cu–Al microelectronics interconnects
Modelling and Simulation in Materials Science and Engineering · 2024
- Modelling and Simulation in Materials Science and Engineering×1
- Journal of Electronic Materials×1
- Karthikeyan Hariharan
Engineering · The Ohio State University
- Haijun Su
Engineering · The Ohio State University
- Jung-Ting Tsai
Engineering · Purdue University West Lafayette
- M. Noor‐A‐Alam
Engineering · Indiana University
- Blake Barnett
Engineering · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile