LabCompass

Junsang Lee

Engineering · Purdue University West Lafayette

Mid career · publishing since 2008Rising activity

Publications

69

Citations

1,491

Est. group size

~9

Recurring co-author estimate

Active years

19

Publishing since 2008

Research summary
AI-generated

This researcher works on materials engineering topics, particularly using indentation testing (a technique that presses a small tip into a material's surface to measure its mechanical properties) to study residual stress and elastic behavior in metals and steel structures. Related work spans polishing/planarization processes for materials manufacturing, catalysis and nanozyme materials for chemical and biosensing applications, and flexible strain sensors. The overall body of work reflects a broad engineering group spanning mechanical characterization, materials chemistry, and applied nanomaterials.

Indentation testing and residual stress analysisSurface polishing and planarization (chemical-mechanical processes)Catalysis and nanozyme materialsFlexible and biodegradable strain sensorsMetal and thin-film mechanics

Publication output has grown markedly over the last decade, rising from a couple of papers per year in 2017-2019 to a peak of 13 in 2023, with continued strong output through 2025.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 6.4/year recently
2017: 2 publications172018: 5 publications182019: 3 publications19202021: 5 publications212022: 2 publications222023: 13 publications13232024: 7 publications242025: 8 publications252026: 2 publications26
Recent publications
Publishes in
  • SSRN Electronic Journal×6
  • Metals and Materials International×4
  • ACS Nano×3
  • Advanced Functional Materials×3
  • ACS Applied Materials & Interfaces×3
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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