LabCompass

Gopinath Sahu

Engineering · Purdue University West Lafayette

Early career · publishing since 2020Rising activity

Publications

24

Citations

380

Est. group size

~5

Recurring co-author estimate

Active years

7

Publishing since 2020

Research summary
AI-generated

Gopinath Sahu works on thermal management engineering, focusing on how to cool high-power electronic chips and packages using liquid jets, sprays, and two-phase (liquid-to-vapor) cooling systems. Recent work centers on direct-on-chip and multi-chip jet impingement cooling designs, including microporous surfaces, phase separation membranes, and manifold structures aimed at cooling densely packed computer chips and server hardware. Earlier work also examined spray and loop heat pipe cooling for high-power LED modules.

Electronics cooling and thermal managementTwo-phase jet impingement coolingSpray and droplet heat transferMicrofabricated/porous surface heat transfer enhancementChip and server-level packaging thermal design

Publication output has grown notably over the last decade, rising from no recorded output in 2017-2019 to a steady stream of several papers per year since 2022, with the most recent years (2024-2026) showing the highest activity.

Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026

Publication cadence
Publications per year over the last 10 years — averaging 4.0/year recently
1718192020: 2 publications202021: 1 publication212022: 4 publications222023: 1 publication232024: 5 publications242025: 6 publications6252026: 4 publications26
Recent publications
Publishes in
  • Applied Thermal Engineering×3
  • International Journal of Heat and Mass Transfer×3
  • Thermal Science and Engineering Progress×1
  • IEEE Transactions on Components Packaging and Manufacturing Technology×1
  • Advances in heat transfer×1
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This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.

Last updated Jul 20, 2026.

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