Gopinath Sahu
Engineering · Purdue University West Lafayette
Publications
24
Citations
380
Est. group size
~5
Recurring co-author estimate
Active years
7
Publishing since 2020
Gopinath Sahu works on thermal management engineering, focusing on how to cool high-power electronic chips and packages using liquid jets, sprays, and two-phase (liquid-to-vapor) cooling systems. Recent work centers on direct-on-chip and multi-chip jet impingement cooling designs, including microporous surfaces, phase separation membranes, and manifold structures aimed at cooling densely packed computer chips and server hardware. Earlier work also examined spray and loop heat pipe cooling for high-power LED modules.
Publication output has grown notably over the last decade, rising from no recorded output in 2017-2019 to a steady stream of several papers per year since 2022, with the most recent years (2024-2026) showing the highest activity.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Comparative Analysis of Deep Learning Models for Person Detection
Lecture notes in electrical engineering · 2026
- Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
Journal of Electronic Packaging · 2026
- Thermal–Hydraulic Performance of Ultra-Confined Two-Phase Jet-Impingement Cooling With Distributed Inlet–Outlet Manifolds
ASME Journal of Heat and Mass Transfer · 2026
- Direct-on-chip confined two-phase jet impingement cooling utilizing water with membrane-based phase separation
International Journal of Heat and Mass Transfer · 2026
- Multi-chip Jet impingement cooling for heat dissipation in 2.5D integrated system with 1 kW+ thermal design power
International Journal of Heat and Mass Transfer · 2025
- Direct-on-chip two-phase jet impingement cooling of multichip packages: Distributed inlet-outlet nozzles
International Journal of Heat and Mass Transfer · 2025
- First Demonstration of Metal-Lidded Integral Microjet Impingement on-Chip Cooling Structures with Alternating Feeding and Draining Nozzles for High-Performance Interposer Packages
2025
- Concept Design of a Confined, Direct Two-Phase Jet Impingement Cooler with Phase Separation of Low-Surface-Tension Fluids
2025
- EFFECT OF NOZZLE ORIFICE DIAMETER AND POSITION OF HYDRAULIC JUMP ON STAGNATION POINT HEAT TRANSFER DURING LIQUID JET IMPINGEMENT COOLING
Journal of Flow Visualization and Image Processing · 2025
- Direct-On-Chip Two-Phase Microjet Cooling With Surface-Enhanced Electrodeposited Microporous Structures
2025
- Experimental Investigation of a Compact Lid-Compatible Multijet Impingement Manifold for Direct-On-Chip Cooling
IEEE Transactions on Components Packaging and Manufacturing Technology · 2024
- Heat Transfer Enhancement for Direct-on-Chip Impingement Jet Cooling using Variable Micro Pin Fins and Tapered Impingement Cavity
2024
- Characterization of Enhanced Two-Phase Jet Impingement on Femtosecond Laser Surface Processed (FLSP) Aluminum Surfaces
2024
- Experimental Investigation of a Compact Lid-Compatible Multi-jet Impingement Manifold for Direct-On-Chip Cooling
2024
- A Novel Multi-Chip Cooling System Using Direct-on-Chip Jet Impingemnt for High-Performance Interposer Package
2024
- Applied Thermal Engineering×3
- International Journal of Heat and Mass Transfer×3
- Thermal Science and Engineering Progress×1
- IEEE Transactions on Components Packaging and Manufacturing Technology×1
- Advances in heat transfer×1
- Chien-Shing Lee
Engineering · Purdue University West Lafayette
- İzzet Şahin
Engineering · Purdue University West Lafayette
- Louis Christensen
Engineering · The Ohio State University
- Faraz Ahmad
Engineering · Purdue University West Lafayette
- Ketan Yogi
Engineering · Purdue University West Lafayette
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile