Ali Shakouri
Materials Science · Purdue University West Lafayette
Publications
620
Citations
18,401
Est. group size
~28
Recurring co-author estimate
Active years
35
Publishing since 1992
Ali Shakouri's research centers on thermal transport and heat management in electronic and photonic devices, including thermoreflectance imaging techniques used to measure temperature and thermal properties in chips, thin films, and 3D-integrated circuits. His group also studies thermoelectric materials (which convert heat into electricity), nanoscale heat flow, and metrology tools for industrial manufacturing and failure analysis. Some publications reflect broader collaborations outside this core area, such as oil and gas reservoir engineering and educational tools for engineering courses.
Publication output has been fairly steady over the past decade, fluctuating between roughly 8 and 21 papers per year, with a peak in 2022 followed by a gradual decline through 2025-2026.
Generated by claude-sonnet-5 from public bibliographic data · Jul 20, 2026
- Instance camera focus prediction for crystal agglomeration classification
arXiv (Cornell University) · 2026
- Instance camera focus prediction for crystal agglomeration classification
arXiv (Cornell University) · 2026
- EM-Thermal Correlation Technologies for Industrial-Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules
2024
- Feasibility Assessment of Acid Gas Injection in an Iranian Offshore Aquifer
Applied Sciences · 2023
- Combined Thermo-Reflectance and Thin-Film Coating in Near-Field Imaging of Chip-Package-PCB-Antenna Modules for Industrial-Testing and Failure Analysis
2023
- Feasibility Assessment of Acid Gas Injection in Saline Aquifers: A Case Study of an Iranian Offshore
Preprints.org · 2023
- Real‐Time Metrology for Roll‐To‐Roll and Advanced Inline Manufacturing: A Review
Advanced Materials Technologies · 2022
- Hydrodynamic thermal transport in silicon at temperatures ranging from 100 to 300 K
Physical review. B./Physical review. B · 2022
- Estimating thin-film thermal conductivity by optical pump thermoreflectance imaging and finite element analysis
Journal of Applied Physics · 2022
- Surface wetting to enhance thermoreflectance characterization of integrated circuits
Review of Scientific Instruments · 2022
- Full-field pump-probe thermoreflectance imaging for characterization of thin films and 3D integrated circuits
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) · 2022
- Optimum directional well path design considering collapse and fracture pressures
International Journal of Oil Gas and Coal Technology · 2022
- Integrated cryogenic quantum refrigeration of electrons.
Institut International du Froid · 2021
- A numerical method for potential implementation of underbalanced drilling in high pore pressure reservoirs
International Journal of Oil Gas and Coal Technology · 2021
- Anisotropic thermal conductivity of the nanoparticles embedded GaSb thin film semiconductor
Nanotechnology · 2020
- arXiv (Cornell University)×17
- Applied Physics Letters×5
- Electronic Imaging×5
- Physical review. B./Physical review. B×4
- Scientific Reports×4
- Kazuaki Yazawa
Materials Science · Purdue University West Lafayette
- Shouyuan Huang
Materials Science · Purdue University West Lafayette
- Yang Guo
Materials Science · The Ohio State University
- Karl G. Koster
Materials Science · The Ohio State University
- Joseph P. Heremans
Materials Science · The Ohio State University
This profile was generated automatically from public scholarly data (OpenAlex). Group size and activity levels are estimates derived from co-authorship patterns.
Last updated Jul 20, 2026.
Claim or correct this profile